ATHENIS3D: Automotive Tested High-Voltage and Embedded Non-volatile Integrated System-on-Chip Platform Employing 3D Integration
Project EC FP7 – Information & Communication technologies 1/11/2013 – 30/04/2017
Slides of the Final Review Meeting, Graz (Austria), 28 June 2017
ATHENIS_3D_final_review_WP2WP3
Eu funding: 6 MEuros, Project cost: 9 MEuros
UNIPI funding: 297.3 kEuros, UNIPI cost: 400 kEuros
Partners: AMS (Austria), Valeo (France), Crocus (France), Fraunhofer (Germany), TU Wien (Austria), AT (Italy), Maser (Netherlands), Besi (Austria), CEA-Leti (France), Università di Pisa (Italy), Università di Ferrara (Italy)
Project Keywords: Automotive Electronics, Integrated DC-DC converters, Measurements in harsh environments (electrical, thermal, power, EMI)
Role of Prof. S. Saponara: technical/scientific leader of WP5 Testchip development involving UNIPI, AMS, FRAUNHOFER, CEA-LETI, MASER, VALEO
Publications in Athenis3D EU project:
Saponara, S., Ciarpi, G., “IC design and measurement of an inductorless 48V DC/DC converter in low-cost CMOS technology facing harsh environments”, IEEE Transactions on Circuits and Systems I, 2017, pp. 1-14, doi: 10.1109/TCSI.2017.2713702, in Press
Saponara, S., Tisserand, P., Chassard, P., My-Ton Dieu, “Design and Measurement of Integrated Converters for Belt-driven Starter-generator in 48 V Micro/mild Hybrid Vehicles”, IEEE Transactions on Industry Applications, pp. 1-13, 2017, doi: 10.1109/TIA.2017.2687406, In Press
Saponara, S., Ciarpi, G., Groza, V. “Design and experimental measurement of EMI reduction techniques for integrated switching DC/DC converters”, IEEE Canadian Journal of Electrical and Computer Engineering, vol. 40, n. 2, pp. 1-12, 2017, doi: 10.1109/CJECE.2017.2703107
Saponara, S., Ciarpi, G., “Electrical and Electromagnetic Measurements of an Inductorless DC/DC Converter”, IEEE I2MTC 2017
Saponara, S., Ciarpi, G., “Universal and inductorless DC/DC converter for multi-output power supplies in sensor and actuator networks”, Paper 10246-39, SPIE Microtechnologies 2017
Saponara, S., et al., “Failure analysis of plastic packages for low-power ICs”, Lecture Notes in Electrical Engineering, 2017
Sisto, A., Saponara, S., et al., “Testing of DC/DC Converters for 48 V Electric Vehicles”, Lecture Notes in Electrical Engineering, 2017
Saponara, S., et al., “Improving Electromagnetic Compatibility of Integrated Switching Converters for Hybrid/electric Vehicles”, IEEE EPEC 2016, pp. 1-6
Saponara, S., et al., “48 V DC/DC switched-cap converter for hybrid/electric vehicles”, GE 2016
Wachmann, E., Saponara, S., et al., “ATHENIS_3D: Automotive tested high-voltage and embedded non-volatile integrated SoC platform with 3D technology”, IEEE Design, Automation & Test in Europe Conference & Exhibition (DATE), pp. 894-899, 2016
Saponara S., et al., “DC/DC converter integrated architecture for 48V supplies in micro/mild hybrid vehicle electrical engine control module”, IEEE 16th International Conference on Environment and Electrical Engineering (EEEIC), 2016, DOI: 1109/EEEIC.2016.755585
Wachmann, E. Saponara S. et al., “Automotive Tested High Voltage and Embedded Non-Volatile Integrated System on Chip platform employing 3D Integration”, European Battery, Hybrid and Fuel Cell Electric Vehicle Congress (EEVC) 2015
Patents in Athenis3D EU project:
Tisserand, P., Chassard, P., Saponara, S., Ferrari, L., “Convertisseur DC-DC intégrable sur silicium avec isolation galvanique capacitive”, patent EU MFR1045, ID 3294, September 2015
Project Objectives:
Automotive represents 12% of the EU industrial GDP. 20% of the value of a car is already electronics. Minimizing costs and space for additional functionality requires further integration. The EU project ATHENIS has successfully addressed System-on-Chip (SoC) integration of CMOS, high voltage and embedded memory for harshest automotive conditions. ATHENIS_3D provides the industry’s first 3D heterogeneous integration technology platform for harshest automotive conditions with Through Silicon Vias (TSV) and Wafer Level Packaging (WLP). A demonstrator hybrid-car proves the functionality of the 3D integrated electronics for a new Belt-driven Starter-Generator (BSG) electrical machine with embedded control electronics and the first DCDC converter with integrated passives for the new 48V standard. For this purpose substantial technological barriers such as flipchip mounting of SoC devices on a HVMOS Si interposer with Integrated Passive Devices (IPD), meeting reliability requirements up to 200C application temperatures, have to be mastered for the first time. Full characterization of the new circuits and systems is provided through thermal, electrical, power and EMI measurements. Research results can be applied also in the fields of energy, robotics and industry 4.0
WorckPackages
WP1 | PROJECT COORDINATION | E. Wachmann, AMS |
WP2 | SYSTEM AND TECHNOLOGY SPECIFICATION | P. Tisserand, Valeo |
WP3 | IPD, HV and NVM DEVELOPMENT | K. Mackay, Crocus |
WP4 | 3D/TSV & WLP DEVELOPMENT | J. Charbonnier, CEA Leti |
WP5 | TESTCHIP DEVELOPMENT | S. Saponara, UNIPI |
WP6 | PROCESS AND PLATFORM INTEGRATION | J. Siegart, AMS |
WP7 | SYSTEM DEVELOPMENT AND EVALUATION | P. Tisserand, Valeo |
WP8 | CHARACTERIZATION AND RELIABILITY | C. Zambelli, UNIFE |
WP9 | DISSEMINATION AND EXPLOITATION | K. Ronijak, AMS |