Industry panel for IEEE ICC 2024 accepted

The industry panel entitled “Key challenges for high-performance 6G communications in smart environments”, which I had the honor to organize, has been accepted to Industry Forum & Exhibition program of the IEEE International Conference on Communications (ICC), Denver, CO, USA, June 2024

The panelists are the following:
George C. Alexandropoulos, National and Kapodistrian University of Athens (NKUA), Greece;
Mate Boban, Huawei, Germany;
Liesbet Van der Perre, KU Leuven, Belgium;
Andreas Mueller, Bosch GmbH, Germany;
Taro Eichler, Rohde & Schwarz, Germany.

Stay tuned for news along this industry panel.

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