{"id":1,"date":"2017-01-08T09:07:42","date_gmt":"2017-01-08T08:07:42","guid":{"rendered":"http:\/\/people.unipi.it\/cloner\/?p=1"},"modified":"2017-07-16T12:36:35","modified_gmt":"2017-07-16T10:36:35","slug":"athenis3d","status":"publish","type":"post","link":"https:\/\/people.unipi.it\/sergio_saponara\/athenis3d\/","title":{"rendered":"Athenis3D"},"content":{"rendered":"

ATHENIS3D:\u00a0Automotive Tested High-Voltage and Embedded Non-volatile Integrated System-on-Chip Platform Employing 3D Integration <\/strong><\/p>\n

Project EC FP7 – Information & Communication technologies\u00a01\/11\/2013 – 30\/04\/2017<\/p>\n

Slides of the Final Review Meeting, Graz (Austria), 28 June 2017<\/p>\n

ATHENIS_3D_final_review_WP1<\/a><\/p>\n

ATHENIS_3D_final_review_WP2WP3<\/a><\/p>\n

ATHENIS_3D_final_review_WP4<\/a><\/p>\n

ATHENIS_3D_final_review_WP5<\/a><\/p>\n

ATHENIS_3D_final_review_WP5b<\/a><\/p>\n

ATHENIS_3D_final_review_WP6<\/a><\/p>\n

ATHENIS_3D_final_review_WP7<\/a><\/p>\n

ATHENIS_3D_final_review_WP8<\/a><\/p>\n

ATHENIS_3D_final_review_WP9<\/a><\/p>\n

 <\/p>\n

Eu funding: 6 MEuros, Project cost: 9 MEuros<\/p>\n

UNIPI funding: 297.3 kEuros, UNIPI cost: 400\u00a0\u00a0kEuros<\/p>\n

Partners: AMS (Austria), Valeo (France), Crocus (France), Fraunhofer (Germany), TU Wien (Austria), AT (Italy), Maser (Netherlands), Besi (Austria), CEA-Leti (France), Universit\u00e0 di Pisa (Italy), Universit\u00e0 di Ferrara (Italy)<\/p>\n

Project Keywords: Automotive Electronics, Integrated DC-DC converters, Measurements in harsh environments (electrical, thermal, power, EMI)<\/p>\n

Role of Prof. S. Saponara: technical\/scientific leader of\u00a0WP5 Testchip development\u00a0involving UNIPI, AMS, FRAUNHOFER, CEA-LETI, MASER, VALEO<\/p>\n

Publications in Athenis3D EU project:<\/strong><\/p>\n

Saponara, S.,<\/strong> Ciarpi,\u00a0G., \u201cIC design and measurement of an inductorless 48V DC\/DC converter in low-cost CMOS technology facing harsh environments\u201d, IEEE Transactions on Circuits and Systems I, 2017, pp. 1-14, doi: 10.1109\/TCSI.2017.2713702, in Press<\/p>\n

Saponara, S.,<\/strong>\u00a0<\/strong>Tisserand, P., Chassard, P., My-Ton Dieu, \u201cDesign and Measurement of Integrated Converters for Belt-driven Starter-generator in 48 V Micro\/mild Hybrid Vehicles\u201d,\u00a0IEEE Transactions on Industry Applications, pp. 1-13,\u00a02017,\u00a0doi:\u00a010.1109\/TIA.2017.2687406<\/a>, In Press<\/p>\n

Saponara, S.,<\/strong> Ciarpi,\u00a0G., Groza, V. \u201cDesign and experimental measurement of EMI reduction techniques for integrated switching DC\/DC converters\u201d, IEEE Canadian Journal of Electrical and Computer Engineering, vol. 40, n. 2, pp. 1-12, 2017, doi:\u00a010.1109\/CJECE.2017.2703107<\/p>\n

Saponara, S., <\/strong>Ciarpi,\u00a0G., “Electrical and Electromagnetic Measurements of an Inductorless DC\/DC Converter”,\u00a0<\/em>IEEE I2MTC 2017<\/p>\n

Saponara, S., <\/strong>Ciarpi,\u00a0G.,\u00a0\u201cUniversal and inductorless DC\/DC converter for multi-output power supplies in sensor and actuator networks\u201d,\u00a0Paper 10246-39, SPIE Microtechnologies 2017<\/p>\n

Saponara, S.,<\/strong>\u00a0et al., \u201cFailure analysis of plastic packages for low-power ICs\u201d, Lecture Notes in Electrical Engineering, 2017<\/p>\n

Sisto, A., Saponara, S.<\/strong>, et al., \u201cTesting of DC\/DC Converters for 48 V Electric Vehicles\u201d, Lecture Notes in Electrical Engineering, 2017<\/p>\n

Saponara, S.,<\/strong>\u00a0et al., \u201cImproving Electromagnetic Compatibility of Integrated Switching Converters for Hybrid\/electric Vehicles\u201d, IEEE EPEC 2016, pp. 1-6<\/p>\n

Saponara, S.,<\/strong>\u00a0et al., \u201c48 V DC\/DC switched-cap converter for hybrid\/electric vehicles\u201d, GE 2016<\/p>\n

Wachmann, E., Saponara, S.,<\/strong> et al., \u201cATHENIS_3D: Automotive tested high-voltage and embedded non-volatile integrated SoC platform with 3D technology\u201d, IEEE Design, Automation & Test in Europe Conference & Exhibition (DATE), pp. 894-899, 2016<\/p>\n

Saponara S.,<\/strong> et al., \u201cDC\/DC converter integrated architecture for 48V supplies in micro\/mild hybrid vehicle electrical engine control module\u201d, \u00a0IEEE 16th International Conference on Environment and Electrical Engineering (EEEIC), 2016, DOI:\u00a01109\/EEEIC.2016.755585<\/p>\n

Wachmann, E. Saponara S<\/strong>. et al., \u201cAutomotive Tested High Voltage and Embedded Non-Volatile Integrated System on Chip platform employing 3D Integration\u201d, European Battery, Hybrid and Fuel Cell Electric Vehicle Congress (EEVC) 2015<\/p>\n

Patents in Athenis3D EU project:<\/strong><\/p>\n

Tisserand, P., Chassard, P., Saponara, S<\/strong>., Ferrari, L., \u201cConvertisseur DC-DC int\u00e9grable sur silicium avec isolation galvanique capacitive\u201d, patent EU MFR1045, ID 3294, September 2015<\/p>\n

Project Objectives: <\/strong><\/p>\n

Automotive represents 12% of the EU industrial GDP. 20% of the value of a car is already electronics. Minimizing costs and space for additional functionality requires further integration. The EU project ATHENIS has successfully addressed System-on-Chip (SoC) integration of CMOS, high voltage and embedded memory for harshest automotive conditions. ATHENIS_3D provides the industry’s first 3D heterogeneous integration technology platform for harshest automotive conditions with Through Silicon Vias (TSV) and Wafer Level Packaging (WLP). A demonstrator hybrid-car proves the functionality of the 3D integrated electronics for a new Belt-driven Starter-Generator (BSG) electrical machine with embedded control electronics and the first DCDC converter with integrated passives for the new 48V standard. For this purpose substantial technological barriers such as flipchip mounting of SoC devices on a HVMOS Si interposer with Integrated Passive Devices (IPD), meeting reliability requirements up to 200C application temperatures, have to be mastered for the first time. Full characterization of the new circuits and systems is provided through thermal, electrical, power and EMI measurements. Research results can be applied also in the fields of energy, robotics and industry 4.0<\/p>\n

WorckPackages<\/strong><\/p>\n\n\n\n\n\n\n\n\n\n\n\n
WP1<\/td>\nPROJECT COORDINATION<\/td>\nE. Wachmann, AMS<\/td>\n<\/tr>\n
WP2<\/td>\nSYSTEM AND TECHNOLOGY SPECIFICATION<\/td>\nP. Tisserand, Valeo<\/td>\n<\/tr>\n
WP3<\/td>\nIPD, \u00a0HV\u00a0 and NVM DEVELOPMENT<\/td>\nK. Mackay, Crocus<\/td>\n<\/tr>\n
WP4<\/td>\n3D\/TSV & WLP DEVELOPMENT<\/td>\nJ. Charbonnier, CEA Leti<\/td>\n<\/tr>\n
WP5<\/td>\nTESTCHIP DEVELOPMENT<\/td>\nS. Saponara, UNIPI<\/td>\n<\/tr>\n
WP6<\/td>\nPROCESS AND PLATFORM INTEGRATION<\/td>\nJ. Siegart, AMS<\/td>\n<\/tr>\n
WP7<\/td>\nSYSTEM DEVELOPMENT AND EVALUATION<\/td>\nP. Tisserand, Valeo<\/td>\n<\/tr>\n
WP8<\/td>\nCHARACTERIZATION AND RELIABILITY<\/td>\nC. Zambelli, UNIFE<\/td>\n<\/tr>\n
WP9<\/td>\nDISSEMINATION AND EXPLOITATION<\/td>\nK. Ronijak, AMS<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

 <\/p>\n","protected":false},"excerpt":{"rendered":"

ATHENIS3D:\u00a0Automotive Tested High-Voltage and Embedded Non-volatile Integrated System-on-Chip Platform Employing 3D Integration Project EC FP7 – Information & Communication technologies\u00a01\/11\/2013…<\/p>\n

Leggi tutto…<\/a><\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[3],"tags":[],"class_list":["post-1","post","type-post","status-publish","format-standard","hentry","category-news"],"acf":[],"featured_image_src":null,"author_info":{"display_name":"ecadmin","author_link":"https:\/\/people.unipi.it\/sergio_saponara\/author\/ecadmin\/"},"yoast_head":"\nAthenis3D - Sergio Saponara<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/people.unipi.it\/sergio_saponara\/athenis3d\/\" \/>\n<meta property=\"og:locale\" content=\"it_IT\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Athenis3D - Sergio Saponara\" \/>\n<meta property=\"og:description\" content=\"ATHENIS3D:\u00a0Automotive Tested High-Voltage and Embedded Non-volatile Integrated System-on-Chip Platform Employing 3D Integration Project EC FP7 – Information & Communication technologies\u00a01\/11\/2013…Leggi tutto...\" \/>\n<meta property=\"og:url\" content=\"https:\/\/people.unipi.it\/sergio_saponara\/athenis3d\/\" \/>\n<meta property=\"og:site_name\" content=\"Sergio Saponara\" \/>\n<meta property=\"article:published_time\" content=\"2017-01-08T08:07:42+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2017-07-16T10:36:35+00:00\" \/>\n<meta name=\"author\" content=\"ecadmin\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Scritto da\" \/>\n\t<meta name=\"twitter:data1\" content=\"ecadmin\" \/>\n\t<meta name=\"twitter:label2\" content=\"Tempo di lettura stimato\" \/>\n\t<meta name=\"twitter:data2\" content=\"4 minuti\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/people.unipi.it\\\/sergio_saponara\\\/athenis3d\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/people.unipi.it\\\/sergio_saponara\\\/athenis3d\\\/\"},\"author\":{\"name\":\"ecadmin\",\"@id\":\"https:\\\/\\\/people.unipi.it\\\/sergio_saponara\\\/#\\\/schema\\\/person\\\/75b5bc7b282e3bc6763aafe6276b6a31\"},\"headline\":\"Athenis3D\",\"datePublished\":\"2017-01-08T08:07:42+00:00\",\"dateModified\":\"2017-07-16T10:36:35+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/people.unipi.it\\\/sergio_saponara\\\/athenis3d\\\/\"},\"wordCount\":753,\"articleSection\":[\"News\"],\"inLanguage\":\"it-IT\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/people.unipi.it\\\/sergio_saponara\\\/athenis3d\\\/\",\"url\":\"https:\\\/\\\/people.unipi.it\\\/sergio_saponara\\\/athenis3d\\\/\",\"name\":\"Athenis3D - 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